University of Wisconsin Madison
Processing of Electronic Materials (E C E 544) Syllabus
Course Learning Outcomes
    Course Learning Outcome
  • 1
    This course addresses the basic chemical and physical techniques used in the modern processing of materials at the micro and nanoscales particularly in the microelectronics industry. Simple device concepts are developed and used to relate the influence of the process technology to the device fabrication and materials characteristics.
  • 2
    The relation between the properties of a deposited thin film and the deposition process is developed.
  • 3
    The underlying physical and chemical features common to many of these processes is emphasized.
  • 4
    While focusing on techniques used for the development of both Si and compound semiconductor-based technologies, the use and extension of these processing techniques to other types of materials is developed.
Processing of Electronic Materials
E C E 544 ( 3 Credits )
Physics and chemistry principles underlying microelectronic materials processing. Effects of processing on materials and structures important in microelectronic and opto-electronic devices.
CBE 440 or MS&E 351 or ECE 335; or cons inst
College: College of Engineering
Instructor Name
Instructor Campus Address
Contact Hours
Course Coordinator
Text book, title, author, and year

Process Engineering Analysis in Semiconductor Device Fabrication, S. Middleman and A.K. Hochberg, McGraw-Hill.

Supplemental Materials
Required / Elective / Selected Elective
Selected Elective
ABET Program Outcomes Associated with this Course
Program Specific Student Outcomes
Brief List of Topics to be Covered
  1.     Introduction to materials
  2.     Physical deposition
  3.     Ion beam modification of materials
  4.     Lithography
  5.     Chemical vapor deposition
  6.     Dielectric formation
  7.     Reaction-diffusion based processing
  8.     Etching processes
  9.     Epitaxial growth
  10.     Plasma processes
  11. Packaging materials.
Additional Information
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