University of Wisconsin Madison
Plasma Processing and Technology (E C E 528) Syllabus
Course Learning Outcomes
    Course Learning Outcome
  • 1
    Specify or establish plasma properties over a wide parameter range.
  • 2
    Explain the concepts of thermionic emission, secondary emission, ionization, charge exchange, confinement, and stability.
  • 3
    Use a combination or resources (class text, class notes and literature) to solve problems.
  • 4
    Solve problems involving DC (hot cathode, magnetron, arc jet) and RF (capacitive, inductive, helicon, surface wave, arc jet) sources.
  • 5
    Solve problems and develop designs for systems involving plasma etching and thin and thick film deposition.
  • 6
    Write a paper based on literature survey of a particular plasma processing technique.
Plasma Processing and Technology
E C E 528 ( 3 Credits )
Introduction to basic understanding and techniques. Plasma processing of materials for semiconductors, polymers, plasma spray coatings, ion implantation, etching, arcs, extractive metallurgy and welding. Plasma and materials diagnostics.
Physics 322 or ECE 320 or equiv or cons inst
College: College of Engineering
Instructor Name
Instructor Campus Address
Contact Hours
Course Coordinator
Text book, title, author, and year
Principles of Plasma Discharges and Material Processing; Lieberman and Lichtenberg; 2nd; 2005
Supplemental Materials
Required / Elective / Selected Elective
Selected Elective
ABET Program Outcomes Associated with this Course
Program Specific Student Outcomes
Brief List of Topics to be Covered

- Basic plasma and gas discharge concepts

- Glow discharge plasmas

- RF plasmas

- Computer simulation techniques

- Plasma source ion implantation

- Sputtering

- Plasma chemistry, etching and polymerization

- Diamond and diamond-like films

- Diagnostics/Probes

- Optical diagnostics: LIF and OGS

- Arcs and arc jets

- Plasma torches and sprays

Additional Information
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