University of Wisconsin Madison
Integrated Circuit Fabrication Laboratory (E C E 549) Syllabus
Course Learning Outcomes
    Course Learning Outcome
  • 1
    Students will be able to create partial/full process flow for creating semiconductor devices starting from bare wafer using techniques typical for semiconductor manufacturing such as lithography, oxidation, chemical vapor deposition, dry/wet etching etc.
  • 2
    Students will understand operation and will be able to operate various tools used in semiconductor device fabrication such as spinners, mask aligner, furnace etc.
  • 3
    Students will be able to use mathematical models to calculate details related to manufacturing or characterization of semiconductor devices.
Details
Integrated Circuit Fabrication Laboratory
E C E 549 ( 3 Credits )
Description
Monolithic integrated circuit fabrication; mask making, photolithography, oxidation, diffusion, junction evaluation, metallization, packaging, and testing.
Prerequisite(s)
ECE 548 or cons inst
Department: ELECTRICAL AND COMPUTER ENGR
College: College of Engineering
Instructor
Instructor Name
Instructor Campus Address
instructorEmail@emailaddress.edu
Contact Hours
7.5
Course Coordinator
SRDJAN MILICIC
Text book, title, author, and year
Silicon VLSI technology : fundamentals, practice and modeling, James D. Plummer, Michael Deal, Peter B. Griffin. (2000)
Supplemental Materials
None
Required / Elective / Selected Elective
Selected Elective
ABET Program Outcomes Associated with this Course
Program Specific Student Outcomes
 
Brief List of Topics to be Covered
  1. Crystal Growth, Wafer Fabrication and Basic Properties of Silicon wafers
  2. Semiconductor Manufacturing: Clean Rooms, Wafer Cleaning and Gettering
  3. Lithography
  4. Thermal Oxidation and Si/SiO2 Interface
  5. Dopant Diffusion
  6. Ion Implantation
  7. Thin Film Deposition
  8. Etching
  9. MOSFET Fabrication and Characterization
Additional Information
 
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